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7001 Dipping Systems
MODEL 7001 Dipping Module Termination
Model 7001 includes:
- High quality termination for chips as small as 0402
- Programmable control for insertion/withdrawal speeds, dip and blot type
- Accurate, uniform bandwidths
- Slow insertion into paste helps eliminate pinholes
- Built in programmed leveling, eliminates off-line chip leveling
- Totally enclosed system
- Reduces solvent evaporation/increases material life
- Precision ground metal doctor blade
Mechanical Immersion Accuracy:
+/- 0.002″ (+/- 0.05 mm)
Immersion Rate:
0.002″ – 0.02″/sec.
(0.05–5 mm/sec.)
Withdrawal Rate:
0.002″ – 0.02″/sec.
(0.05 – 5 mm/sec.)
Dwell Time:
Dip or blot: 0–999 sec.
Throughput:
Cycle rate 30–40 sec. per plate
(dependent upon process parameters)
Number of Programs Permanently Stored: 65
Reservoir Capacity:
300 grams minimum
(dependent upon required termination band)
Setup Time:
Less than 5 minutes
Cleanup Time:
Approximately 10 minutes
Carrier Plate:
Size: 7″ x 11″
Changeover Time:
Approximately 10 minutes
Utility Requirements:
Power: Standard 220 V, 50/60 Hz, 1 phase, 15 A
Compressed air: 45–80 psi, 5 cfm
(420 – 560 kPa, 0.15m3/min.)
Physical Dimensions:
Length: 26″ (66 cm)
Width: 29″ (74 cm)
Height: 31″ (79cm)
Shipping Weight:
Approximately 350 lb. (159 kg)