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7001 Dipping Systems

MODEL 7001 Dipping Module Termination

7001 edit w BDD machine label

Model 7001 includes: 

 

  • High quality termination for chips as small as 0402
  • Programmable control for insertion/withdrawal speeds, dip and blot type
  • Accurate, uniform bandwidths
  • Slow insertion into paste helps eliminate pinholes
  • Built in programmed leveling, eliminates off-line chip leveling
  • Totally enclosed system
  • Reduces solvent evaporation/increases material life
  • Precision ground metal doctor blade

 

Mechanical Immersion Accuracy:
+/- 0.002″ (+/- 0.05 mm)

Immersion Rate:
0.002″ – 0.02″/sec.
(0.05–5 mm/sec.)

Withdrawal Rate:
0.002″ – 0.02″/sec.
(0.05 – 5 mm/sec.)

Dwell Time:
Dip or blot: 0–999 sec.

Throughput:
Cycle rate 30–40 sec. per plate
(dependent upon process parameters)

Number of Programs Permanently Stored: 65

Reservoir Capacity:
300 grams minimum 
(dependent upon required termination band)

Setup Time:
Less than 5 minutes

Cleanup Time:
Approximately 10 minutes

Carrier Plate:
Size: 7″ x 11″

Changeover Time:
Approximately 10 minutes

Utility Requirements:
Power: Standard 220 V, 50/60 Hz, 1 phase, 15 A
Compressed air: 45–80 psi, 5 cfm
(420 – 560 kPa, 0.15m3/min.)

Physical Dimensions:
Length: 26″ (66 cm)
Width: 29″ (74 cm)
Height: 31″ (79cm)
Shipping Weight:
Approximately 350 lb. (159 kg)